Cleanroom (Class 100)
The cleanroom is complete with HEPA filters, AHU, exhaust scrubber and DI water plant which process 18 M ohm DI water. Our cleanroom houses wafer fabrication processing and cleaning equipment closely monitored by Lighthouse facilities monitoring System and Soxal gas detection system. Students will be given hands-on opportunities at :Silicon wafer fabrication process.
Wafer Process Equipment include :
| - | Lithography Equipment | |
| - | RIE Etcher | |
| - | Wet bench for Wet Etch/Cleaning | |
| - | PECVD | |
| - | LPCVD | |
| - | Evaporator | |
| - | Oxidation & Diffusion Furnace | |
| - | Laser Writer | |
| - | CV measurement tools | |
| - | 4 pt probe | |
| - | Ellipsometer |
The Vacuum Training Centre
A one-stop center, it houses seven different configurations of vacuum (low, medium & high level) technology consisting of the following:
| Pumps | ||
| - | Rotary pump | |
| - | Turbo pump | |
| - | Cryo pump, | |
| Vacuum Gauges | ||
| - | Cap manometer | |
| - | Ion gauge | |
| - | Pirnani gauge, | |
| Others | ||
| - | MFC gas controller | |
| - | RGA gas analyser | |
| - | Leak detector |
The Test and Measurement Laboratory
The Test Lab is equipped with equipment to service the digital, mixed signal and memory markets. The Lab consists of the following:
| - | HP digital tester, | |
| - | Boundary-scan interactive | |
| - | Network Anaylser | |
| - | Mixed-signal test units | |
| - | Device characterisation equipment | |
| - | HP impedance Analyser |
The IC Design Laboratory
The IC Design Laboratory has equipment with sophisticated Electronic Design Automation (EDA) tools, and has application software for:
| - | VLSI/ASIC Design – with Cadence and Mentor Graphics tools. | |
| - | Field Programmable Gate Array (FPGA) Design – with Xilinx tools | |
| - | Systems-On-Chip (SOC) Design – with Aptix tools | |
| - | PCB Design – with Mentor Graphics tools | |
| - | Semiconductor Device Simulation and Process Simulation and Process Simulation – with Silvaco and TMA Virtual Wafer Fab tools. |
The Failure Analysis (FA) Laboratory
It is equipped with various state-of-art tools for wafer and IC package analysis, the lab also prepares all students with the necessary knowledge and skills in failure analysis.
Sophisticated equipment that students have access to include:
| - | Precision X-Sectioning | |
| - | SAM (Scanning Acoustic Microscope ) | |
| - | Light Microscopy | |
| - | SEM ( Scanning Electron Microscope ) | |
| - | EDS (Energy Dispersive X-ray Spectroscope ) | |
| - | Microprober | |
| - | Parametric Analyser | |
| - | BGA/Flip Chip System | |
| - | Liquid Crystal Hotspot technique | |
| - | Wire bonder + Bond pull | |
| - | Die Attach + Die shear |
